1. 2. 3. material content data sheet sales product name bsz018ne2ls issued 19. february 2015 ma# MA001336490 package pg-tsdson-8-26 weight* 36.78 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.671 1.82 1.82 18243 18243 leadframe inorganic material phosphorus 7723-14-0 0.002 0.01 67 non noble metal zinc 7440-66-6 0.010 0.03 267 non noble metal iron 7439-89-6 0.197 0.53 5349 non noble metal copper 7440-50-8 7.988 21.72 22.29 217175 222858 wire noble metal gold 7440-57-5 0.028 0.07 0.07 748 748 encapsulation organic material carbon black 1333-86-4 0.037 0.10 999 plastics epoxy resin - 1.893 5.15 51470 inorganic material silicondioxide 60676-86-0 16.451 44.74 49.99 447237 499706 leadfinish non noble metal tin 7440-31-5 0.395 1.07 1.07 10746 10746 plating noble metal silver 7440-22-4 0.020 0.06 0.06 552 552 solder noble metal silver 7440-22-4 0.024 0.06 649 non noble metal tin 7440-31-5 0.019 0.05 519 non noble metal lead 7439-92-1 0.912 2.48 2.59 24797 25965 heatspreader inorganic material phosphorus 7723-14-0 0.001 0.00 32 non noble metal zinc 7440-66-6 0.005 0.01 128 non noble metal iron 7439-89-6 0.094 0.26 2555 non noble metal copper 7440-50-8 3.816 10.37 10.64 103741 106456 heat sink clip inorganic material phosphorus 7723-14-0 0.001 0.00 34 non noble metal zinc 7440-66-6 0.005 0.01 138 non noble metal iron 7439-89-6 0.101 0.28 2753 non noble metal copper 7440-50-8 4.112 11.18 11.47 111801 114726 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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